5 meilleures offres (backend engineer (python)) (à pourvoir)

Own transistor-level and block-level custom layout for mixed-signal, SRAM, and custom-digital IP that powers our compute-in-memory SRAM (ComputeRAM®). You will plan floorplans, implement device-level layouts with production-grade matching/guarding, close DRC/LVS/PEX on advanced nodes down to 4 nm and below, and collaborate tightly with custom-design, digital, and PD/STA teams to hit aggressive PPA, yield, and reliability targets. You will bridge classic analog techniques (common-centroid/interdigitation, shielding, isolation) with FinFET/FDSOI rules, multi-patterning/EUV constraints, and modern DFM practices.

What you’ll do

Plan & implement full-custom layouts for standard cells, custom datapaths, and SRAM periphery/arrays.
Drive and provide feedback to the design team to converge on the most power-aware design layout possible.
Interface & integrate: align with schematic owners on constraints; define pins/abstracts, LEF views, keep-outs, and tiling for memory-like macros; coordinate with MBIST/scan wrappers and test hooks.
Automate & document: maintain checklists, templates, and layout guidelines; script repetitive tasks (TCL, Python)

Outcomes (first 18 months)

Tape-in and silicon of one or more custom blocks or macros with clean DRC/LVS/PEX and correlated post-silicon parasitics (report + lessons-learned).

Requirements

5+ years in custom layout for analog/SRAM/custom-digital IP; strong ownership from floorplan to sign-off.
Demonstrated quality on sub-28 nm nodes; practical know-how for FinFET/FDSOI, multi-patterning/EUV constraints, coloring.
Solid analog layout techniques: common-centroid, interdigitation, current-mirror symmetry, matched routing, shielding/guard rings, substrate noise isolation.
Working grasp of timing/IR/EM implications of layout; ability to read extraction/timing reports and iterate with designers/PD/STA.
Clear communication, rigorous documentation, and a collaboration mindset across custom design, digital, and backend teams.

Nice to have

Experience with SRAM arrays/periphery, redundancy/repair hooks, MBIST/scan routing constraints.
TCL/Python for layout automation and report generation.
DFM/DFY exposure
ESD/latch-up design practice; EM/IR sign-off collaboration at the macro level.
Comfort producing LEF and working with integration/floorplanning teams on macro delivery.

Apply

Send your CV and a short note (2–3 paragraphs on a design you owned, your toughest bug & how you solved it, an intro on what you like to do and how you see yourself as an engineer)

Interview flow (indicative)

30-min intro with HR (role/context)

First Technical deep dive

Second Technical Deep Dive

(Optional) Third Technical Deep Dive

Systems/product conversation with management

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